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Tanaka Kikinzoku Kogyo establishes gold bump transfer technology for complex substrate shapes and optoelectronic devices
Thursday, March 5, 2026 at 06:40 AM
Tanaka Precious Metals has successfully developed a transfer technology for gold bumps that supports substrates with complex shapes, targeting applications in optoelectronic integrated devices and advanced packaging.
Context
Japanese precious metals leader Tanaka Kikinzoku Kogyo has established a breakthrough gold bump transfer technology designed for high-density semiconductor mounting. Utilizing its proprietary AuRoFUSE low-temperature fired paste, the company can now manufacture gold bumps separately and transfer them to specific target locations. This process enables a 4 μm fine-pitch mounting with 20 μm bumps, achieving metal bonding at temperatures as low as 200°C and a pressure of 20 MPa. Unlike traditional methods, this sintered gold technology maintains its shape with minimal horizontal deformation, ensuring high reliability for complex substrate shapes.
This innovation is a critical enabler for the next generation of optoelectronic devices, such as semiconductor lasers and LEDs, where heat sensitivity and extreme miniaturization are primary constraints. By facilitating denser integration and lower thermal stress during the bonding process, Tanaka Holdings is addressing the escalating hardware requirements for 3D ICs, AI processors, and high-speed communications. The company began active distribution of technology samples in March 2024, targeting the global advanced packaging supply chain.
Sources (9)
Tanaka Precious Metals and SUSS MicroTec to Jointly Develop Sub ...Tanaka establishes new semiconductor bonding tech - Compound Semiconductor News
TANAKA Establishes Bonding Technology for High-Density Semiconductor Mounting Using AuRoFUSE™ Preforms
TANAKA Establishes Transfer Technology for its Sintered ...TANAKA Establishes Transfer Technology for its Sintered ...Directed Self-Assembly based Interconnect Technology for Next ...What Is Bumping? The Key Technology Behind Advanced Packaging - PCBMASTERTANAKA Establishes Transfer Technology
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Tanaka Holdings Co., Ltd.