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TechInsights releases technical data on SMIC N+3 process node pitches
Monday, March 9, 2026 at 09:42 AM
Analysis of SMIC N+3 process node pitches is now available through TechInsights, providing technical data on the Chinese foundry's advanced manufacturing progress.
Context
Recent technical analysis from TechInsights has confirmed that SMIC has successfully moved into volume production of its N+3 process node, as evidenced by the Kirin 9030 SoC found in the Huawei Mate 80 Pro Max. This development marks a significant milestone for China’s semiconductor industry, as it represents a 5nm-class capability achieved entirely without EUV lithography. Instead, SMIC is utilizing advanced multi-patterning techniques with existing DUV equipment to push beyond its previous 7nm (N+2) limits.
While the N+3 node provides a density leap over prior generations, technical data suggests it remains less scaled than the leading 5nm offerings from TSMC and Samsung. The process relies on complex quadruple-patterning (SAQP), which likely faces higher manufacturing costs and lower yields. Despite these hurdles, China is aggressively scaling capacity, aiming to increase advanced wafer output from 20,000 to 100,000 per month within the next two years to support domestic AI infrastructure.
Sources (8)
Huawei–SMIC chip hits milestone, still lags TSMC's 5nm - digitimesSMIC N+3 Confirmed: Kirin 9030 Analysis Reveals How Close SMIC Is to 5nm | TechInsights3 nm process - WikipediaHuawei's latest mobile is armed with China's most advanced process node to date despite using blacklisted chipmaker — Huawei Kirin 9030 mobile SoC made on SMIC N+3 process, but can't compete with 5nm node | Tom's HardwareSMIC BEOL photolithography process analysis / N+3 yield issuesKirin 9030 Analysis Shows the Foundry's N+3 Progress - TechInsightsChinese SMIC Produces 5nm Chips on N+3 Node Without Using EUV Equipment | News & ArticlesChina aims for fivefold increase in advanced chip output to meet AI demand
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