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Samsung leverages SF3 production experience for SF2 mass production and integrated product bundling
Monday, January 12, 2026 at 08:26 AM
Samsung has successfully shipped chips using its SF3 process and is leveraging these early production stages to improve yields for the upcoming SF2 node. The company plans to offer integrated solutions by bundling its advanced foundry services with its internal DRAM, HBM, and SSD product lines.
Context
Samsung is leveraging early successes with its SF3 (3nm) process to accelerate the roadmap for its upcoming SF2 (2nm) node. Having already deployed SF3 chips in consumer devices like the Galaxy Watch, the company is utilizing the learning curve from its Gate-All-Around (GAA) architecture to stabilize yields. This early transition to GAA—a technology competitors are only adopting at the 2nm stage—positions Samsung to begin mass production of SF2 for mobile applications in 2025, followed by high-performance computing in 2026.
Beyond node shrinkage, Samsung is pivoting toward a "one-stop" integrated supply chain model to differentiate itself from TSMC. By bundling its foundry services with in-house DRAM, HBM3E, and SSD solutions, the company claims it can reduce total production lead times by approximately 20%. This turnkey approach is particularly attractive for AI chip designers who require tight integration between logic and high-bandwidth memory, allowing Samsung to capture a larger share of the silicon-to-system value chain.
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