Rumor
Fuso Chemical's Colloidal Silica Expected for iPhone 18's N2 Process and WMCM Packaging
Saturday, December 6, 2025 at 01:32 AM
A report suggests that the 2026 iPhone 18 models are expected to utilize a significant volume of colloidal silica from Fuso Chemical Co., Ltd. This material is purportedly for use in the N2 process and a new packaging technology known as WMCM.
Context
The upcoming iPhone 18, expected to launch in 2026, will feature Apple's A20 chip, leveraging TSMC's advanced N2 (2nm) process and a new Wafer-Level Multi-Chip Module (WMCM) packaging technology. This technological leap is projected to deliver a significant 15% performance uplift and 30% improved power efficiency compared to the previous generation. TSMC is reportedly targeting a WMCM packaging capacity of approximately 10,000 units per month by 2026 at its Chiayi P1 fab.
This development is particularly relevant for Fuso Chemical, a leading producer of ultra-high-purity colloidal silica, a critical raw material for semiconductor polishing. The increased demand for advanced manufacturing processes like N2 and WMCM is expected to drive demand for Fuso Chemical's products.
Fuso Chemical has proactively expanded its production capabilities, completing new ultra-high-purity colloidal silica manufacturing facilities in 2023, 2024, and 2025, positioning itself to meet the anticipated surge in demand from the semiconductor industry's move to more advanced nodes and packaging solutions.
Sources (8)
Next year's iPhones could get bigger than usual upgrades ...「iPhone 18」シリーズのA20チップ、新技術採用で大幅刷新にiPhone 18's Advanced A20 Chip Packaging Gains ...Apple's A20 SoC Based On TSMC's 2nm N2 Process To ...iPhone 18 to Feature TSMC 2nm Chips with WMCM PackagingiPhone 18の「A20」チップは2nm製造か。新パッケージ技術 ...iPhone 18 Proの画期的な技術 - Vietnam.vn電子材料および機能性化学品 - 扶桑化学工業株式会社 クエン酸 ...
Related Companies
4
Fuso Chemical
4368