News
Broadcom secures dominant share of Google 3nm TPU volume through 2027 amid internal chip delays
Friday, January 2, 2026 at 06:32 AM
Broadcom is strengthening its AI ASIC dominance through 2027 as Google scales TPU deployments to 6-7 million units to support workloads for OpenAI, Anthropic, and Apple. Broadcom's 3nm 'Sunfish' chip holds a significant lead over Google's delayed internal 'Zebrafish' program. Due to tight HBM and CoWoS supply constraints, Google is expected to rely on Broadcom for over 95% of its 2027 volumes, with Broadcom already beginning design work on 2nm TPUs for 2028. Additionally, Broadcom is progressing on 3nm and 2nm programs for Meta.
Context
Broadcom has secured over 95% of Google’s 3nm TPU volume through 2027, as Google’s internal chip program faces significant delays. To support AI workloads for partners like Apple and OpenAI, Google aims to ship 6 to 7 million units in 2027, far exceeding previous market expectations. Broadcom's "Sunfish" architecture holds a clear 18-month technical lead, having already secured a multi-billion dollar backlog while Google’s internal prototypes remain in early development stages.
This dominance extends into the future, with Broadcom already developing 2nm designs for 2028. Continued progress on Meta’s 3nm and 2nm programs further strengthens the AI ASIC outlook for fiscal 2026 and 2027. With extreme scarcity in advanced packaging and HBM supply, Broadcom’s established supply chain makes it difficult for internal initiatives to gain traction. Analysts maintain an Overweight rating, arguing the market underestimates Broadcom’s massive IP portfolio and execution.
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