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ASML CEO projects next-generation EUV mass production to start by 2027 or 2028

Monday, February 9, 2026 at 08:18 PM

ASML CEO expects mass production using next-generation High-NA EUV lithography systems to begin between 2027 and 2028 as customer evaluations proceed.

Context

ASML has officially targeted 2027 to 2028 for the mass production phase of its next-generation High-NA EUV lithography systems. CEO Christophe Fouquet confirmed that while initial units are currently shipping to lead customers, the broader industry transition to ultra-high precision manufacturing will align with the rollout of sub-2nm process nodes. This timeline is essential as standard EUV technology reaches its physical resolution limits, necessitating the shift to 0.55 numerical aperture systems to maintain critical chip density gains. For investors, this shift signals a massive capital expenditure cycle, with each High-NA machine costing roughly $350 million to $400 million. The successful deployment of these systems by 2028 serves as a vital tailwind for the AI supply chain, as Intel, TSMC, and Samsung require this hardware to produce the next generation of energy-efficient processors. This roadmap solidifies ASML’s continued monopoly in high-end lithography and will dictate the pace of global semiconductor innovation through the end of the decade.

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