News
Dow and Toray Commercialize New Thermal Interface Material (TIM) Business for Semiconductor Applications
Friday, December 5, 2025 at 09:09 PM
The Dow-Toray joint venture is launching a new business focused on Thermal Interface Materials (TIMs) that incorporate stress relaxation features to manage thermal expansion, specifically targeting applications in and around semiconductors and Electronic Control Units (ECUs).
Context
On December 4, 2025, Dow and Toray announced their move to commercialize a new Thermal Interface Material (TIM) business, specifically targeting semiconductor and Electronic Control Unit (ECU) applications. This strategic initiative emphasizes stress-relief design to counter thermal-expansion issues, which are critical in high-performance electronic components. This collaboration signals a significant commitment from both companies to address a vital area within the advanced electronics market.
TIMs are a crucial bottleneck for advanced packaging, power electronics, and the overall reliability of EV/ECU systems, making this venture particularly impactful. Dow, with approximately $45 billion in sales in 2023, has new TIM products slated for launch in 2025. Similarly, Toray is prioritizing semiconductor and display materials within its Digital Innovation business, aiming for a substantial DI revenue of ¥250 billion by fiscal year 2025, further underscoring the strategic importance and market potential of this new business.
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