News
Micron expands HBM4 capacity to 15,000 wafers per month for Nvidia Vera Rubin supply
Tuesday, January 6, 2026 at 07:42 AM
Micron is significantly expanding its HBM4 production capacity to 15,000 wafers per month this year, accounting for 30% of its total HBM output. This move aims to supply Nvidia's upcoming Vera Rubin AI platform alongside Samsung and SK Hynix. Micron plans a mass production ramp-up starting in Q2 and is finishing a new advanced packaging plant in Singapore by year-end to support HBM4 manufacturing.
Context
Micron is significantly expanding its footprint in the AI memory sector, planning an HBM4 production ramp of 15,000 wafers per month. This aggressive expansion is targeted for mass production in 2026, setting the stage for a direct confrontation with industry incumbents SK Hynix and Samsung. The company has already begun shipping 36GB 12-high HBM4 samples, reporting bandwidth performance of 2.8 TB/s that outpaces current JEDEC standards and rivals’ existing offerings.
The move is critical as the total addressable market for HBM is forecast to reach $100 billion by 2030. Micron aims to leverage its 1-beta process technology and a strategic collaboration with TSMC for specialized logic dies to secure a 20-25% market share. As NVIDIA and AMD prepare next-generation accelerators like the Rubin architecture, Micron’s capacity increase reflects a broader push to challenge SK Hynix’s 62% market dominance and solidify its position as a Tier-1 supplier in the global AI supply chain.
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