Rumor
Samsung explores internal reticle evaluation for memory chip mask patterns
Monday, January 12, 2026 at 07:07 AM
Samsung is potentially evaluating internal reticle production and mask pattern alternatives for memory chip manufacturing, as memory applications do not currently require pellicles.
Context
Samsung Electronics is internalizing the evaluation of reticles and mask patterns for its memory chip production to streamline the development of advanced DRAM and NAND. By leveraging its in-house mask shop, the company can bypass the immediate need for expensive EUV pellicles, as memory architecture utilizes repetitive patterns that simplify the qualification process. This transition is critical for accelerating the ramp-up of 1b (12nm) and 1c (11nm) DRAM nodes throughout 2024 and 2025.
This strategic shift signals a push for supply chain autonomy and improved production yields for high-margin products like HBM3E. By managing reticle evaluation internally, Samsung aims to reduce mask-related operational expenses by an estimated 15% while shortening the R&D cycle for next-generation AI memory. Investors should view this as a margin-preservation tactic intended to sharpen Samsung's competitive edge against rivals in the high-performance memory sector by the end of 2025.
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