News

SK Hynix launches hybrid bonding pilot line with Applied Materials and Besi equipment

Saturday, February 28, 2026 at 04:38 AM

SK Hynix has established a pilot production line to evaluate hybrid bonding technology for future HBM packaging. The line utilizes the Applied Materials Kinex Bonding System, which integrates a Besi hybrid bonder. This move signifies SK Hynix's preparation for transitioning away from thermocompression bonding as thermal and signal requirements intensify for HBM5 and beyond. While Samsung is also evaluating Besi and its subsidiary SEMES for HBM4E, SK Hynix is considering domestic alternatives like Hanwha Semitech due to the high cost of Besi equipment and supply chain preferences.

Context

SK Hynix has established a hybrid bonding pilot line featuring Applied Materials’ Kinex system and Besi equipment, marking a critical transition toward next-generation HBM packaging. This move signals that the market leader is preparing for HBM4E and HBM5, where hybrid bonding—which eliminates solder bumps—is required to manage heat and signal delay in high-stack structures. The integrated Kinex platform carries a high price tag of approximately $10.7 million per system, leading SK Hynix to evaluate mass production viability alongside potential domestic alternatives like Hanwha Semitech. The competition is accelerating as Samsung Electronics also targets HBM4 commercialization through its subsidiary SEMES and Besi. With major AI customers requesting hybrid-bonded versions by the end of 2024, Besi expects the memory sector to drive significant demand throughout 2025. While Hanmi Semiconductor continues to push high-speed TC bonding for the current market, this shift by SK Hynix underscores the industry's eventual consensus on hybrid bonding as the inevitable standard for future high-density AI memory.

Related Companies

Applied Materials

AMAT

SK Hynix

000660

Samsung Electronics

005930

Hanmi Semiconductor

042700

BESI