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Ajinomoto maintains 95% market share in critical ABF substrate materials for high-performance computing
Monday, March 16, 2026 at 07:03 AM
Ajinomoto maintains a dominant position in the semiconductor supply chain through its production of Ajinomoto Build-up Film (ABF). This insulating material is a critical component for high-performance chip substrates used in CPUs and GPUs, holding approximately 95% of the global market share.
Context
As of March 2026, Japanese firm Ajinomoto continues to hold an overwhelming 95% market share in the production of Ajinomoto Build-Up Film (ABF), a specialized insulating material essential for high-performance computing (HPC) substrates. This film is the industry standard for packaging the complex CPUs and GPUs that power AI data centers and 5G infrastructure. While the company is famously rooted in the food and biotech sectors, its functional materials division has become a strategic chokepoint in the global semiconductor supply chain.
To address surging demand, Ajinomoto is executing a plan to invest 25 billion yen by 2030 to expand production capacity by 50%. This expansion is critical as AI and HPC chips require increasingly complex packaging, with advanced processors utilizing up to 18–20 layers of ABF compared to just 6 layers for standard PC chips. This shift towards higher layer counts and larger substrate areas is projected to drive a CAGR of 16.28% for the ABF substrate market through the next decade.
Sources (10)
AJINOMOTO CO., INC（2802）Ajinomoto Build-Up Film Substrate Market Size Reports Forecast - 2033 [News] Japanese Firm Ajinomoto to Invest JPY 25 Billion by 2030 to Expand ABF Production for Advanced PackagingAjinomoto Build-up Film Market Size, Share and Forecast 2032ABF (Ajinomoto Build-Up Film) Market Size, Share, GrowthABF (Ajinomoto Build-up Film) Market Size & Share [2034]Next-gen packaging materials beyond ABF - Electronics360Top ABF substrate manufacturers and market leaders
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