Nvidia faces challenges in adopting CoWoP due to testing strategy and die size preferences

The tweet discusses the challenges for Nvidia in adopting CoWoP (Chip-on-Wafer-on-Package) due to necessary changes in test strategy for both individual dies and Chip-on-Wafer (CoW) components. It also suggests that CoWoP may not mature if Nvidia continues to prefer reticle-sized dies.