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SK Hynix develops system-level test equipment for HBM4 to ensure SiP compatibility
Tuesday, February 24, 2026 at 09:50 AM
SK Hynix has completed internal qualification for its newly developed system-level test (SLT) equipment designed for HBM4. The equipment mimics real-world integration by testing HBM alongside CPUs and GPUs to verify compatibility and signal integrity within a System-in-Package (SiP) environment. This move allows SK Hynix to internalize final verification processes previously dominated by foundries like TSMC and Samsung, which is critical for the upcoming custom HBM4 market and integration with TSMC's CoWoS technology.
Context
SK Hynix has successfully qualified new system-level test (SLT) equipment for HBM4, marking a strategic shift in the AI semiconductor supply chain. By internalizing SiP (System-in-Package) inspection, the company can now verify memory performance when integrated with high-end GPUs and CPUs from customers like Nvidia and AMD. This preemptive testing identifies signal interference and thermal issues before final assembly, which is essential as HBM4 shifts toward highly customized, logic-integrated architectures.
This move reinforces the technical alliance between SK Hynix and TSMC, optimizing memory for CoWoS packaging used in accelerators like the Nvidia B200 and AMD MI355X. While system testing was historically handled by foundries or Samsung Electronics, SK Hynix’s internalization of these capabilities aims to maximize yields for complex 2.5D stacking. By addressing compatibility early, the company secures its lead in the custom HBM4 market as high-volume production approaches in late 2024 and 2025.
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