Samsung Electronics is reportedly designing logic dies for custom HBM using advanced 2nm process technology. This move aims to enhance performance and power efficiency for custom HBM, particularly for future HBM4E generations and ultra-high-performance AI accelerators. Samsung is also building a portfolio from 4nm to 2nm to meet diverse customer demands, including those from major tech companies like NVIDIA, AMD, Broadcom, AWS, and OpenAI. The company previously used a 4nm process for HBM4 logic dies to gain an advantage over competitors like SK Hynix, which used TSMC's 12nm process.