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EDP and Honda R&D sign letter of intent for joint research on diamond device materials
Thursday, March 26, 2026 at 08:58 AM
EDP and Honda R&D have signed a letter of intent to conduct joint research on diamond materials for semiconductor devices. The collaboration aims to leverage EDP's expertise in synthetic diamond substrates to develop high-performance materials for future electronics and power systems.
Context
EDP Corporation and Honda R&D have signed a letter of intent to launch joint research into single-crystal diamond materials for next-generation power devices. This partnership aims to leverage EDP’s position as Japan’s leading manufacturer of synthetic diamond seeds to develop high-efficiency semiconductor components. By integrating these materials into automotive inverters, Honda seeks to significantly improve the thermal management and power density of electric vehicle (EV) powertrains.
Diamond is widely regarded as the "ultimate" wide-bandgap semiconductor, offering a thermal conductivity 5 times higher than copper and a breakdown voltage far superior to Silicon Carbide (SiC). This collaboration reflects a broader industry push toward industrializing 2-inch and 4-inch diamond wafers. For investors, this marks a critical step in moving diamond electronics from laboratory prototypes toward a scalable 2026-2030 commercialization roadmap within the global AI and EV supply chains.
Sources (11)
ESG Report Honda - 20250001021408-03-004235.txtJapan R&D brings powerful diamond semiconductors ...Diamond Semiconductors: How Far to Industrialization?EDP Corporation.Integrated Annual Report 2022Automotive manufacturing technologies – an international viewpoint | Manufacturing ReviewHonda R&D-AIST Diamond × Electronics Collaborative ...
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