Rumor
Rubin Ultra platform may transition 30% of production to CoWoP packaging
Monday, January 5, 2026 at 06:21 AM
Reports suggest that 30% of Rubin Ultra chips may transition to CoWoP packaging, potentially entering trial production during the Rubin platform cycle. The architecture utilizes mSAP PCB and glass-based CCL materials connected via copper paste lamination. Zhen Ding is positioned as a key supplier for this technology, with its solutions currently undergoing testing at OSATs. CoWoP implementation is estimated to cost approximately $600 per GPU.
Context
NVIDIA is reportedly planning a significant architectural shift for its upcoming Rubin Ultra platform, transitioning roughly 30% of production to CoWoP technology. This strategic move explains TSMC’s measured expansion of CoWoS capacity despite soaring demand, as the industry pivots toward advanced substrate-based integration. Trial production for CoWoP could begin as early as the Rubin launch, moving the timeline up significantly from the original market consensus of late 2027 or 2028.
The transition represents a substantial value surge for the supply chain, with CoWoP costs estimated at $600 per GPU compared to just $200 for current GB200 compute trays. Zhen Ding Technology has emerged as a primary leader in this space, already delivering its solution to OSATs for critical chip-level testing. By integrating mSAP PCB architecture with glass-based substrates, CoWoP provides the high-performance scaling necessary for next-generation AI workloads while shifting profit pools toward advanced substrate manufacturers.
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