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Lintec introduces PCBL resin coating equipment to reduce wafer thickness variation
Wednesday, February 18, 2026 at 09:15 AM
Lintec has developed a new resin coating process called PCBL to address thickness variation and cracking during the wafer back-grinding stage. The process involves applying a UV-curable resin to the peripheral areas of wafers where bumps are absent to level the surface before lamination. The company plans to start accepting full-scale orders for the corresponding RAD-3400F/12 equipment in April 2026.
Context
Lintec announced it will begin accepting full-scale orders for its new RAD-3400F/12 resin coating equipment in April 2026. This machine debut introduces the company’s proprietary PCBL (Pattern Coating Before Lamination) process, designed to solve critical thickness uniformity issues during the semiconductor backgrinding stage. By applying a specialized UV-curable resin to the peripheral areas of wafers, the equipment eliminates height discrepancies caused by circuit bumps, effectively preventing wafer cracks and boosting manufacturing yields.
This technical advancement is particularly significant as the industry shifts toward ultra-thin chips for AI and high-performance computing. Maintaining wafer flatness during the thinning process has become a major challenge in advanced packaging, where even minor variations can lead to structural failure. By addressing these bottlenecks, Lintec aims to secure a stronger foothold in the back-end supply chain, providing essential tools for the production of next-generation logic and memory devices required for 2026 and beyond.
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