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Chinese semiconductor leaders call for policy support to integrate domestic EUV lithography components

Thursday, March 5, 2026 at 10:45 AM

Chinese semiconductor leaders are calling for state policy support to create a domestic equivalent to ASML. While Chinese research institutions have made individual progress in EUV laser light sources, wafer stages, and optical systems, the primary challenge remains the integration of these components into a functional lithography machine.

Context

Leading Chinese semiconductor executives from Naura Technology, YMTC, and SMIC are calling for a coordinated national push to integrate domestic EUV lithography components. While Chinese research institutes have achieved individual breakthroughs in laser sources, wafer stages, and optical systems, the industry currently lacks the systemic integration required to build a functional alternative to ASML. The executives characterize the current domestic landscape as fragmented and urge the government to pool financial and human resources to establish a unified 'China version of ASML.' This strategic shift aims to overcome the primary bottleneck in China's advanced chipmaking capabilities during the 2026-2030 period. Current reports indicate that a prototype EUV machine exists in a high-security Shenzhen laboratory and is successfully generating light, though it has yet to produce functional chips. With the U.S. maintaining strict export controls on advanced machinery, China is targeting 2028 for initial production, with industry analysts citing 2030 as a more realistic milestone for high-volume manufacturing readiness.

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