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Micron completes major structural milestone for new Idaho semiconductor fab
Tuesday, February 3, 2026 at 12:43 AM
Micron has reached a significant structural milestone in the construction of its new semiconductor fabrication plant in Idaho, using 70,000 tons of steel for the facility.
Context
Micron has completed a major structural milestone at its new Boise, Idaho fabrication facility, utilizing 70,000 tons of American steel to reach the project’s vertical peak. This site is a cornerstone of the company’s domestic manufacturing strategy, with leading-edge DRAM production now scheduled to begin in the first half of 2027. Management recently accelerated this timeline to address critical supply shortages in the memory market, particularly for high-performance hardware supporting global artificial intelligence infrastructure.
The project is essential for securing the AI supply chain through domestic High Bandwidth Memory (HBM) production. Micron has already sold out its entire 2026 HBM capacity, making this new volume vital for maintaining market share against international rivals. Supported by $6.4 billion in CHIPS Act direct funding, the Idaho expansion moves Micron toward its goal of manufacturing 40% of its DRAM in the U.S. while co-locating R&D to speed up the delivery of next-generation HBM4 technology.
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