Rumor
Ibiden to invest 500 billion yen in high-performance IC package substrate capacity for AI/servers
Tuesday, February 3, 2026 at 06:41 AM
Ibiden plans to invest approximately 500 billion yen to boost its production capacity for high-performance IC package substrates used in AI and server applications.
Context
Ibiden has announced a major strategic investment of 500 billion yen to scale the production of high-performance IC package substrates, specifically targeting the generative AI server market. This capital expenditure is scheduled to take place over a three-year period from fiscal 2026 to 2028. The initial phase will see 220 billion yen allocated primarily to the Kama plant in Gifu Prefecture, building on the capacity recently added by the Ono plant, which commenced mass production in late 2025.
This massive expansion highlights Ibiden’s pivotal position in the global AI supply chain as a primary supplier for industry leaders including Nvidia, Intel, and AMD. With demand for AI server substrates expected to nearly double in 2025, the investment is designed to cement the company’s dominant global market share. By aggressively prioritizing advanced AI infrastructure over stagnant PC and general-purpose server segments, Ibiden is targeting a long-term annual revenue goal of 750 billion yen by fiscal 2030.
Related Companies
Ibiden
4062